Reasons for the appearance of water lines in blister products:
Water marks generally appear on the surface of the blister packaging plane which is relatively high and has no pit marks, which is caused by the contact between the heated sheet and the blister mold during the blister packaging production process. Because the plane of the blister mold is relatively high and has no pit marks, there is no space for the material to shrink on the surface of the blister mold during the blister thermoforming process, so water marks are produced. Generally speaking, this kind of water marks is difficult to avoid, and can only be reduced by modifying the blister mold or improving the process.
Methods to improve the water pattern of blister products:
1. Improve the blister structure: Modify the blister structure to reduce the generation of water marks.
2. Change the material of the blister mold: Usually the most common blister packaging mold is: copper mold and aluminum mold, because the surface of these two molds are relatively smooth, so the water pattern of the blister product produced is more serious, this situation needs to be changed to rarely used resin mold, resin mold because the surface is relatively rough so it has a very large effect on overcoming water ripples.
3. Change the machine: Add a hot dryer to the machine, like an iron, to smooth the water lines
